JPH0516667B2 - - Google Patents
Info
- Publication number
- JPH0516667B2 JPH0516667B2 JP60273369A JP27336985A JPH0516667B2 JP H0516667 B2 JPH0516667 B2 JP H0516667B2 JP 60273369 A JP60273369 A JP 60273369A JP 27336985 A JP27336985 A JP 27336985A JP H0516667 B2 JPH0516667 B2 JP H0516667B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- wiring board
- silicone resin
- leads
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15182—Fan-in arrangement of the internal vias
- H01L2924/15184—Fan-in arrangement of the internal vias in different layers of the multilayer substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27336985A JPS62133742A (ja) | 1985-12-06 | 1985-12-06 | パツケ−ジ |
| US06/900,532 US4709301A (en) | 1985-09-05 | 1986-08-26 | Package |
| EP86112244A EP0214621B1 (en) | 1985-09-05 | 1986-09-04 | A package comprising a substrate and at least one electronic component |
| DE86112244T DE3688164T2 (de) | 1985-09-05 | 1986-09-04 | Packung mit einem Substrat und mindestens einem elektronischen Bauelement. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27336985A JPS62133742A (ja) | 1985-12-06 | 1985-12-06 | パツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62133742A JPS62133742A (ja) | 1987-06-16 |
| JPH0516667B2 true JPH0516667B2 (en]) | 1993-03-05 |
Family
ID=17526940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27336985A Granted JPS62133742A (ja) | 1985-09-05 | 1985-12-06 | パツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62133742A (en]) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59171343U (ja) * | 1983-04-28 | 1984-11-16 | 株式会社デンソー | 混成集積回路装置 |
| JPS60116151A (ja) * | 1983-11-28 | 1985-06-22 | Matsushita Electric Works Ltd | 電子部品の封止法 |
| JPS6120771U (ja) * | 1984-07-09 | 1986-02-06 | 日本フエラス工業株式会社 | サツシ枠の建付装置 |
-
1985
- 1985-12-06 JP JP27336985A patent/JPS62133742A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62133742A (ja) | 1987-06-16 |
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